IPC- and soldering trainings

IPC-A-610 , IPC/WHMA-A-620 , IPC-7711/7721

J-Std-001 , J-Std-020 , J-Std-033 trainings

IPC-A-610 Courses

The IPC-A-610 (Acceptability of Electronics Assemblies Endorsement Program) Endorsement is included of the following IPC Certification Programs: Certified IPC Specialist (CIS), Certified IPC Trainer (CIT/MIT), Certified Standards Expert (CSE/SCSE)

Topics Covered in the IPC-A-610 Endorsement Program

Establishing and maintaining integrity of the certification program

Purpose and application of IPC-A-610

Hardware installation

Soldering criteria, including lead free connections

Soldered requirements for connecting to terminals

Soldered connection requirements for plated-through holes

Surface mounting criteria for chip components, leadless and leaded chip carriers

Swaged hardware and heatsink requirements of mechanical assemblies

Component mounting criteria for DIPS, socket pins and card edge connectors

Jumper wire assembly requirements

Solder fillet dimensional criteria for all major SMT component groups

Soldering, such as tombstoning, dewetting, voiding and others

Criteria for component damage, laminate conditions, cleaning and coating

Steps to effectively using the lesson plan and materials, tips on inspection and a review of important Certified IPC Trainer skills

Who Should Earn an IPC-A-610 Endorsement

Anyone responsible for the quality and reliability of electronic assemblies should consider becoming an IPC-A-610 Certified IPC Trainer. Trainers and quality supervisors versed in electronic assembly are excellent candidates for A-610 training, as are engineering and manufacturing supervisors with assembly responsibilities.

IPC/WHMA-A-620 Courses

IPC/WHMA-A-620: Requirements and Acceptance for Cable and Wire Harness Assemblies prescribes practices and requirements for the manufacturing of cable, wire, and harness assemblies, and describes materials, methods, tests, and acceptability criteria for producing crimped, mechanically secured, and soldered interconnections, and the related assembly activities associated with cable and harness assemblies.

Topics Covered in IPC/WHMA-A-620 Endorsement

General; Applicable Documents; Preparation; Measuring Cable Assemblies and Wires; Testing

Crimp Terminations; Insulation Displacement Connection

Soldered Terminations; High Voltage Applications

Connectorization; Over-Molding/Potting

Ultrasonic Welding; Splices

Marking/Labeling; Securing; Finished Assembly Installation

Coaxial and Biaxial Cable Assemblies

Harness/Cable Electrical Shielding; Cable/Wire Harness Protective Coverings

Who Should Earn an IPC/WHMA-A-620 Endorsement?

Assembly process engineers, quality assurance supervisors, training managers and others responsible for the quality and reliability of cable and wire harness assemblies are excellent candidates for the program.

An industry developed and approved program that includes training, certification, and instructional materials based on the IPC/WHMA-A-620C is available to your company. Thousands of individuals have been trained to be IPC/WHMA-A-620 Certified IPC Trainers (CIT). A comprehensive and technically accurate program, IPC/WHMA-A-620 Training and Certification provides Certified IPC Trainers with high-quality materials and detailed instructional plans that have been used for training Certified IPC Specialists (CIS) at all levels, including buyers, sales teams and management. More than 20,000 A-620 Application Specialists have been trained.

IPC-7711/7721 Courses

IPC-7711/7721: Rework, Modification and Repair of Electronic Assemblies

This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Endorsement is included of the following IPC Certification Programs: Certified IPC Specialist (CIS), Certified IPC Trainer (CIT/MIT), Certified Standards Expert (CSE/SCSE)

Topics Covered in the IPC-7711/7721 Endorsement Program

Product classifications, skill levels, tools and materials

Basic surface mount and through hole component removal

Land preparation and component installation

Primary heating methods: conductive, convective and others

Handling electronic assemblies

Wire splicing procedures

Through hole component removal and installation

Chip and MELF rework procedures

SOIC/SOT, J-lead and QFP rework

Printed wiring board circuit and laminate repair

Conformal coating removal

Who Should Earn an IPC-7711/7721 Endorsement?

Technicians, manufacturing and quality assurance supervisors who want to demonstrate they have the skills needed to restore operation of expensive electronics assemblies are strongly encouraged to earn this endorsement.

The IPC-7711C/7721 endorsement program is not intended to be an introduction to hand soldering and rework or be a basic hand soldering and/or basic rework course. Prospective candidates should have some experience in rework and repair and good eye/hand coordination. The processes in the IPC-7711C/7721 are intended to be used by operators and technicians who have at least some knowledge and experience in rework and repair of circuit boards. The training uses step-by-step process instructions to build upon the knowledge, skills, and abilities already obtained by the Certified IPC Specialist (CIS) candidate.

J-STD-001 Courses

J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies

IPC-J-STD-001 is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001 standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.

IPC-J-STD-001 is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. J-STD-001 is developed in synergy with IPC-A-610 and is supported by IPC-HDBK-001 for those wanting additional information and explanation on the requirements. If you purchased IPC-J-STD-001 you should also purchase and use IPC-A-610, they work together.

Topics Covered in the IPC J-STD-001 Endorsement Program

Instructional skills and the roles and responsibilities of Certified IPC Trainers (CIT Certification program only)

General requirements, such as safety, tools and electrostatic discharge (ESD)

Wire and terminal assembly requirements, demonstrations and laboratory

Through-hole technology requirements, demonstrations and laboratory

Surface mount technology requirements, demonstrations and laboratory

General soldered connection acceptance requirements (including Lead Free)

Machine and reflow soldering process requirements

Test methods and related standards

Who Should Earn an IPC J-STD-001 Endorsement?

Quality Assurance

Assembly process engineers, quality assurance supervisors, training managers and others responsible for the quality and reliability of soldered electronic assemblies are excellent candidates for the program.

Company-wide quality assurance initiatives can showcase this IPC-sponsored program to illustrate their commitment to continuous operations and product improvement. IPC recognition sends a strong message to customers that your company is serious about implementing J-STD-001.

J-Std-020 Trainings

J-STD-020: Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)

LONG-TERM STORAGE GUIDELINES FOR ELECTRONIC SOLID- STATE WAFERS, DICE, AND DEVICES

(From JEDEC Board Ballot JCB-22-52, formulated under the cognizance of the JC-14.1 Committee on Reliability

Test Methods for Packaged Devices.)

1 Purpose

The purpose of this standard is to identify the classification level of non-hermetic SMDs designed for surface

mount assembly that are sensitive to moisture-induced stress so that they can be properly packaged, stored,

and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

This standard may be used to determine what classification level should be used for non-hermetic SMD

qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-

term reliability. The Moisture Sensitivity Levels (MSLs) rating generated for an SMD by this document is

utilized to determine the soak conditions for preconditioning as per JESD22-A113 and how the SMD can be

properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or

repair operations as per J-STD-033.

For IC devices that may be process sensitive, please refer to J-STD-075 to determine if a PSL (Process

Sensitivity Level) classification is required. This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could

be sensitive to damage during solder reflow. The term SMD as used in this document means plastic

encapsulated devices and other devices made with moisture-permeable materials designed for surface mount

assemblies. The MSL classification levels are intended to be used by SMD producers to inform users (board

assembly operations) of the level of moisture sensitivity of their SMDs, and by board assembly operations

to ensure that proper handling precautions are applied to moisture/reflow sensitive devices.

J-STD-033 Trainings

J-STD-033: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage such as ‘‘cracks and delamination’’ from the solder reflow process. This document describes the standardized levels of floor-life exposure for moisture/reflow sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/ reflow related failures. Companion documents J-STD-020, J-STD-075 and JEP113 define the classification procedure and the labeling requirements, respectively.

For moisture sensitivity, moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMDs to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200 °C. During solder reflow, the combination of rapid moisture expansion, materials mismatch, and material interface degradation can result in cracking and/or delamination of critical interfaces within the device.

Typical solder reflow processes of concern for all devices are convection, convection/IR, infrared (IR), vapor phase (VPR), hot air rework tools, and wave solder, including full immersion.

Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensitivity, flux sensitivity or cleaning process sensitivity. The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date. This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices and other moisture sensitive devices made with moisture-permeable materials

(epoxies, silicones, etc.) that are exposed to the ambient air.

CQI-17 training

CQI-17 Special Process: Electronic Assembly Manufacturing - Soldering System Assessment

CQI-17 is a self-assessment supported by AIAG and now required by many customers.

The most important thing in this training is to select the participants together, because this is essential for a successful audit.

Training objective: Students gain proficiency in the application of the standard Training target group: Everyone who is an essential participant in a successful soldering audit. Competencies to be acquired during the training: Scope, assessment process, application of the standard, completion...

Topics:

1- Introduction, scope, objectives, requirements...

2- Objectives and requirements of CQI-17...

3- Guidance, transfer of "know-how"...

4- Job audit...

Description: During the training, students will become familiar with all the requirements and sub-points of CQI-17 on a theoretical and practical level. The training can be enriched with many tangible examples and even practical demonstrations. The focus of the training is soldering, but many other solutions are also used.

Training conclusion: Written exam

Number of participants: Minimum: 1 person, Maximum: 15 people,

Training duration: 1-3 days,

We issue a registered certificate of the training and also provide assistance in audits.

The instructor provides the course material for the theory for the duration of the training, but it is possible to purchase it.

Individual or special soldering trainings

Soft soldering and Brazing trainings

If you have any soldering problem or need special soldering training, contact us.

Our trainings focus for your prducts, for your tools, for your equipment or for your possibilities.

We will focus for your empleyee. We can train also theoretical, and practical courses.

– 911 (infrared brazing);

– 912 (flame brazing, torch brazing);

– 913 (laser beam brazing);

– 914 (electron beam brazing);

– 916 (induction brazing);

– 918 (resistance brazing);

– 919 (diffusion brazing);

– 921 (furnace brazing);

– 922 (vacuum brazing);

– 923 (dip-bath brazing);

– 924 (salt-bath brazing);

– 925 (flux bath brazing);

– 926 s (immersion brazing);

– 972 (arc weld brazing).

Special soldering trainings

We can train practices from standards and from out of standards.

Ferenc Sarkany and Co.

2740 Abony, Rákóczi Ferenc u. 22

Our Training rooms:

Hu: Békéscsaba, Budapest, Debrecen, Eger, Győr, Kaposvár, Kecskemét, Miskolc, Pécs, Szeged, Székesfehérvár, Szolnok, Tatabánya, Veszprém, Zalaegerszeg

Ro: Arad, Cluj, Timisoara, Oradea

Au: Wien

Sk: Dunajska Streda, Kosice, Bratislava

Pol: Kraków

Slo: Soon

Srb: Soon

Ua: Mukacsevo, Uzsgorod

+36-30-381-1185 - info@mikrotech.hu

Magyar oldal: www.mikrotech.hu